Patent Assignment
Reel/Frame 016506/0143
Assignment of Assignor's Interest
Recorded: 2005-04-28
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package Including at Least One Semiconductor Device Enclosed Therein