Multi-chip package including at least one semiconductor device enclosed therein
A multi-chip package, a semiconductor device used therein, and manufacturing method thereof are provided. The multi-chip package may include a substrate having a plurality of substrate bonding pads formed on an upper surface thereof, at least one first semiconductor chip mounted on the substrate, and at least one second semiconductor chip mounted on the substrate where the at least one first semiconductor chip may be mounted. The at least one second semiconductor chip may include at least one three-dimensional space so as to allow the at least one first semiconductor chip to be enclosed within the at least one three-dimensional space. The at least one three-dimensional space may be a cavity, a groove, or a combination thereof.
1. A multi-chip package, comprising:
a substrate including a plurality of substrate bonding pads formed on an upper surface and a lower surface thereof;
at least one first semiconductor chip mounted on the upper surface of the substrate;
at least one second semiconductor chip mounted on the lower surface of the substrate;
at least one third semiconductor chip mounted on the upper surface of the substrate, the at least one third semiconductor chip having a non-active surface having a cavity, a groove or combination thereof thereof enclosing the at least one first semiconductor chip; and
at least one fourth semiconductor chip mounted on the lower surface of the substrate, the at least one fourth semiconductor chip having a non-active surface having a cavity, a groove or combination thereof thereof enclosing the at least one second semiconductor chip.
2. The multi-chip package of claim 1 , wherein the at least one first, second, third and fourth semiconductor chips are connected to the substrate bonding pads by at least one of a wire-bond and a flip-chip bond.
3. The multi-chip package of claim 1 , wherein the at least one second and at least one fourth semiconductor chips, mounting portions and bonding portions of the mounting portions are encapsulated.
4. The multi-chip package of claim 1 , wherein the at least one first and at least one third semiconductor chips, mounting portions and bonding portions of the mounting portions are encapsulated.
5. The multi-chip package of claim 1 , wherein the substrate is at least one of a molded lead frame, a printed circuit board, a direct bond copper (DBC), a flexible film, and an interposer.
6. The multi-chip package of claim 1 , wherein the at least one first semiconductor chip and the at least one second semiconductor chip are radio frequency (RF) chips, and the at least one third semiconductor chip and the at least one fourth semiconductor chip are chips for a memory or a logic circuit.