Assignment of Assignor's Interest

Recorded: 2005-05-02 Pages: 3

Assignors

SONODA, HIROMI

Executed: 2005-02-28

NAKAMURA, KATSUJI

Executed: 2005-02-26

Assignee

SHINRYO ELECTRONICS CO., LTD.

1-2, SHIROISHI, KUROSAKI, YAHATANISHI-KU, KITAKYUSHU-SHI, FUKUOKA 806-0004, JAPAN

Covered Property (1)

Tin-Silver-Copper Plating Solution, Plating Film Containing the Same, and Method for Forming the Plating Film

Patent: 7,273,540 →

Application: 11/039,841 →

Publication: US 2005/0184369

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.