Merger

Recorded: 2008-09-25 Pages: 10

Assignor

SHINRYO ELECTRONICS CO., LTD.

Executed: 2008-04-09

Assignee

SHINRYO CORPORATION

5TH FLOOR, NISSEI SHINKUROSAKI BUILDING, 9-24, KUROSAKI 3-CHOME, YAHATANISHI-KU, KITAKYUSHU-SHI, JAPAN

Covered Property (1)

Tin-Silver-Copper Plating Solution, Plating Film Containing the Same, and Method for Forming the Plating Film

Patent: 7,273,540 →

Application: 11/039,841 →

Publication: US 2005/0184369

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.