Patent Assignment
Reel/Frame 016626/0221
Corrected Assignment- 1ST and 2ND Inventors' Names Incorrectly Reversed on a Document Recorded on Reel 015975 Frame 0743
Recorded: 2005-05-27
Pages: 3
Assignors
KIKUCHI, KOYA
Executed: 2004-09-28
SHIMADA, NORIOU
Executed: 2004-09-28
KUSANAGI, KEIYO
Executed: 2004-09-28
HATASAWA, AKIHIKO
Executed: 2004-09-28
KAGAYA, YUTAKA
Executed: 2004-09-28
Assignee
AKITA ELECTRONICS SYSTEMS CO., LTD.
85 AZA USHIRONO AIKAWA, YUWA-MACHI, KAWAHA-GUN, AKITA, JAPAN
Covered Property
(1)
A Semiconductor Device Including a Semiconductor Chip Formed on an Insulating Element Such as a Tape, and Including an Improved Insulating Arrangement
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 9, 2004
From: KOYA, KIKUCHI; NORIOU, SHIMADA; KUSANAGI, KEIYO; HATASAWA, AKIHIKO
To: AKITA ELECTRONICS SYSTEMS CO., LTD.
Reel/Frame 015975/0743 →
Assignment of Assignor's Interest
Dec 14, 2006
From: AKITA ELECTRONICS SYSTEMS CO., LTD.
To: ELPIDA MEMORY, INC.
Reel/Frame 018679/0230 →
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →