IP Library Assignment 016667/0014
Patent Assignment
Reel/Frame 016667/0014

Assignment of Assignor's Interest

Recorded: 2005-06-09 Pages: 8
Assignors
LOCHTEFELD, ANTHONY J.
Executed: 2003-08-15
LANGDO, THOMAS A.
Executed: 2003-08-15
HAMMOND, RICHARD
Executed: 2005-04-18
CURRIE, MATTHEW T.
Executed: 2003-08-15
FITZGERALD, EUGENE A.
Executed: 2003-08-22
Assignee
AMBERWAVE SYSTEMS CORPORATION
13 GARABEDIAN DRIVE, SALEM, NEW HAMPSHIRE, 03079
Covered Properties (5)
Strained-Semiconductor-On-Insulator Device Structures
Patent: 7,259,388 →
Application: 11/120,675 →
Publication: US 2005/0189563
Strained-Semiconductor-On-Insulator Device Structures with Elevated Source/Drain Regions
Patent: 7,420,201 →
Application: 11/125,507 →
Publication: US 2005/0218453
Strained Germanium-on-Insulator Device Structures
Patent: 7,414,259 →
Application: 11/126,550 →
Publication: US 2005/0205934
Methods for Forming Strained-Semiconductor-on-Insulator Device Structures by Use of Cleave Planes
Patent: 7,297,612 →
Application: 11/127,508 →
Publication: US 2005/0212061
Methods for Forming Strained-Semiconductor-on-Insulator Device Structures by Mechanically Inducing Strain
Patent: 7,588,994 →
Application: 11/128,628 →
Publication: US 2005/0199954
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 26, 2010
From: AMBERWAVE SYSTEMS CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 023848/0183 →