IP Library Assignment 016677/0273
Patent Assignment
Reel/Frame 016677/0273

Assignment of Assignor's Interest

Recorded: 2005-10-24 Pages: 9
Assignors
CHIU, CHIN-TIEN
Executed: 2005-10-11
LIAO, CHIH-CHIN
Executed: 2005-10-11
WANG, KEN JIAN MING
Executed: 2005-10-10
CHEN, HAN-SHIAO
Executed: 2005-10-11
YU, CHEEMEN
Executed: 2005-10-12
TAKIAR, HEM
Executed: 2005-10-10
Assignee
SANDISK CORPORATION
140 CASPIAN COURT, SUNNYVALE, CALIFORNIA, 94089
Covered Property (1)
Rigid Wave Pattern Design on Chip Carrier Substrate and Printed Circuit Board for Semiconductor and Electronic Sub-System Packaging
Patent: 7,355,283 →
Application: 11/106,699 →
Publication: US 2006/0231943
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 1, 2011
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 026368/0693 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038813/0004 →