Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
1. A first pattern formed of an electrical connector on a first surface of a substrate, the substrate capable of supporting and electrically connecting to a semiconductor dice, a second surface of the substrate opposite the first surface including a second pattern, the first pattern comprising:
an etched portion;
an unetched portion surrounding the etched portion, the first pattern for reducing a mechanical stress generated by the second pattern on the semiconductor dice during a molding process;
wherein the etched portion of the first pattern on the first surface of the substrate aligns with and overlies a portion of the second pattern;
wherein the portion of the second pattern is a contact finger for forming an external electrical connection; and
wherein the etched portion of the first pattern forms a portion of an ellipse, said ellipse having a width approximately equal to a width of the contact finger, and said ellipse having a length greater than or equal to a length of the contact finger.
2. A first pattern as recited in claim 1 , the portion of the ellipse having a width approximately equal to a width of the contact finger, and the portion of the ellipse having a length approximately equal to a length of the contact finger.
3. A first pattern formed of an electrical connector on a first surface of a substrate, the substrate capable of supporting and electrically connecting to a semiconductor dice, a second surface of the substrate opposite the first surface including a second pattern, the first pattern comprising:
an etched portion;
an unetched portion surrounding the etched portion, the first pattern for reducing a mechanical stress generated by the second pattern on the semiconductor dice during a molding process;
wherein the etched portion of the first pattern on the first surface of the substrate aligns with and overlies a portion of the second pattern;
wherein the portion of the second pattern is a contact finger for forming an external electrical connection; and
wherein the etched portion of the first pattern includes a pair of etched sections aligned generally along a length of the etched portion, and lateral etched sections extending laterally between the pair of etched sections.
4. A rigid wave pattern formed on a first surface of a substrate, the substrate capable of supporting and electrically connecting to a semiconductor dice, a second surface of the substrate opposite the first surface including one or more contact fingers for making one or more external electrical connections, the rigid wave pattern comprising:
one or more etched portions on the first surface, an etched portion of the one or more etched portions forming a portion of an elipse overlying a contact finger of the one or more contact fingers on the second surface, said ellipse having a width approximately equal to a width of the contact finger, and said ellipse having a length greater than or equal to a length of the contact finger; and
an unetched portion surrounding the one or more etched portions, the rigid wave pattern capable of reducing a mechanical stress generated by the contact finger on the semiconductor dice during a molding process.
5. The rigid wave pattern as recited in claim 4 , the substrate including:
a core having a first surface and a second surface opposite the first surface;
a first conductive layer formed on the first surface of the core, the rigid wave pattern being formed in the first conductive layer; and
a second conductive layer formed on the second surface of the core, the one or more contact fingers being formed in the second conductive layer.
6. The rigid wave pattern as recited in claim 4 , wherein the rigid wave pattern is formed in a copper layer of the substrate.
7. The rigid wave pattern as recited in claim 4 , wherein the unetched portion of the rigid wave pattern is rectangular in shape.
8. A rigid wave pattern formed on a first surface of a substrate, the substrate capable of supporting and electrically connecting to a semiconductor dice, a second surface of the substrate opposite the first surface including one or more contact fingers for making one or more external electrical connections, the rigid wave pattern comprising:
one or more etched portions on the first surface, an etched portion of the one or more etched portions forming a portion of an ellipse overlying a contact finger of the one or more contact fingers on the second surface, said ellipse having a width approximately equal to a width of the contact finger, and said ellipse having a length greater than or equal to a length of the contact finger; and
an unetched portion surrounding the one or more etched portions, the rigid wave pattern capable of reducing a mechanical stress generated by the contact finger on the semiconductor dice during a molding process;
said portion of the ellipse having a width approximately equal to a width of the contact finger, and portion of the ellipse having a length approximately equal to a length of the contact finger.
9. A rigid wave pattern formed on a first surface of a substrate, the substrate capable of supporting and electrically connecting to a semiconductor dice, a second surface of the substrate opposite the first surface including one or more contact fingers for making one or more external electrical connections, the rigid wave pattern comprising:
one or more etched portions on the first surface, an etched portion of the one or more etched portions including a pair of etched sections aligned generally along a length of the etched portion and lateral etched sections extending laterally between the pair of etched sections, and overlying a contact finger of the one or more contact fingers on the second surface; and
an unetched portion surrounding the one or more etched portions, the rigid wave pattern capable of reducing a mechanical stress generated by the contact finger on the semiconductor dice during a molding process.
10. The rigid wave pattern as recited in claim 9 , the substrate including:
a core having a first surface and a second surface opposite the first surface;
a first conductive layer formed on the first surface of the core, the rigid wave pattern being formed in the first conductive layer; and
a second conductive layer formed on the second surface of the core, the one or more contact fingers being formed in the second conductive layer.
11. The rigid wave pattern as recited in claim 9 , wherein the rigid wave pattern is formed in a copper layer of the substrate.
12. The rigid wave pattern as recited in claim 9 , wherein the unetched portion of the rigid wave pattern is rectangular in shape.