Patent Assignment
Reel/Frame 016677/0704
Assignment of Assignor's Interest
Recorded: 2005-08-29
Pages: 3
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Chip Having Pollished and Ground Bottom Surface Portions
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.