IP Library Assignment 016694/0422
Patent Assignment
Reel/Frame 016694/0422

Assignment of Assignor's Interest

Recorded: 2005-06-15 Pages: 2
Assignors
KIDA, TSUYOSHI
Executed: 2005-05-31
NODA, TAKAMITSU
Executed: 2005-05-31
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property (1)
Semiconductor Wafer and Manufacturing Process for Semiconductor Device
Patent: 7,554,211 →
Application: 11/152,092 →
Publication: US 2005/0282360
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0868 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →