Patent Assignment
Reel/Frame 016716/0645
Assignment of Assignor's Interest
Recorded: 2005-06-22
Pages: 3
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property
(1)
Method of Dicing a Semiconductor Substrate into a Plurality of Semiconductor Chips by Forming Two Cutting Grooves on One Substrate Surface and Forming One Cutting Groove on an Opposite Substrate Surface That Overlaps the Two Cutting Grooves
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.