Patent Assignment
Reel/Frame 016747/0571
Assignment of Assignor's Interest
Recorded: 2005-06-30
Pages: 3
Assignors
LEE, HAE-HYUNG
Executed: 2005-06-25
PARK, SANG-WOOK
Executed: 2005-06-27
BAEK, JOONG-HYUN
Executed: 2005-06-25
LEE, DONG-HO
Executed: 2005-06-25
LEE, JIN-YANG
Executed: 2005-05-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Package with Thermoelectric Cooler