Patent Assignment
Reel/Frame 016759/0687
Assignment of Assignor's Interest
Recorded: 2005-09-08
Pages: 2
Assignor
PHILIPS SEMICONDUCTORS, INC.
Executed: 2005-02-16
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, EINDHOVEN, 5621 BA, NETHERLANDS
Covered Property
(1)
Bonded Wafer with Metal Silicidation
Patent:
6,909,146 →
Application:
09/316,580 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 5, 2010
From: INTERSIL CORPORATION; TECHWELL, INC.; INTERSIL COMMUNICATIONS, INC.; QUELLAN, INC.
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 024390/0608 →
Release of Security Interest
May 26, 2010
From: CREDIT SUISSE FIRST BOSTON
To: INTERSIL CORPORATION
Reel/Frame 024445/0049 →