Patent Assignment
Reel/Frame 016802/0324
Assignment of Assignor's Interest
Recorded: 2005-07-21
Pages: 4
Assignors
CHIU, SUNG-CHENG
Executed: 2005-06-20
TSAI, HAO-YI
Executed: 2005-06-22
YU, HSIU-MEI
Executed: 2005-06-22
CHEN, SHIH-MING
Executed: 2005-06-20
HOU, SHANG-YUN
Executed: 2005-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC 300-77, TAIWAN
Covered Property
(1)
Method for Forming High Reliability Bump Structure