IP Library › Assignment 016825/0604
Patent Assignment
Reel/Frame 016825/0604

Assignment of Assignor's Interest

Recorded: 2005-11-29 Pages: 5
Assignors
ISLAM, SHAFIDUL
Executed: 2005-09-09
SAN ANTONIO, RICO
Executed: 2005-09-12
SUBAGIO, ANANG
Executed: 2005-09-12
Assignee
ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
BATAMINDO INDUSTRIAL PARK, MUKA KINING, BATAM ISLAND, 29433, INDONESIA
Covered Property (1)
Die Pad for Semiconductor Packages and Methods of Making and Using Same
Patent: 7,262,491 →
Application: 11/220,761 →
Publication: US 2007/0052070
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Correction to 2ND Inventor's Name on Reel and Frame 016825-0604 Feb 2, 2007
From: ISLAM, SHAFIDUL; SAN ANTONIO, ROMARICO SANTOS; SUBAGIO, ANANG
To: ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 018852/0208 →