IP Library › Assignment 018852/0208
Patent Assignment
Reel/Frame 018852/0208

Correction to 2ND Inventor's Name on Reel and Frame 016825-0604

Recorded: 2007-02-02 Pages: 9
Assignors
ISLAM, SHAFIDUL
Executed: 2005-09-09
SAN ANTONIO, ROMARICO SANTOS
Executed: 2006-11-20
SUBAGIO, ANANG
Executed: 2006-09-12
Assignee
ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
BATAMINDO INDUSTRIAL PARK, MUKA KINING, BATAM ISLAND, 29433, INDONESIA
Covered Property (1)
Die Pad for Semiconductor Packages and Methods of Making and Using Same
Patent: 7,262,491 →
Application: 11/220,761 →
Publication: US 2007/0052070
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 29, 2005
From: ISLAM, SHAFIDUL; SAN ANTONIO, RICO; SUBAGIO, ANANG
To: ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 016825/0604 →