Assignment of Assignor's Interest

Recorded: 2005-09-23 Pages: 3

Assignor

CHOI, SEUNG-MAN

Executed: 2005-09-22

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Methods of forming copper interconnect structures on semiconductor substrates

Application: 11/234,535 →

Publication: US 2007/0072413

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.