IP Library Assignment 017528/0317
Patent Assignment
Reel/Frame 017528/0317

Assignment of Assignor's Interest

Recorded: 2006-04-26 Pages: 2
Assignor
CHAE, MOOSUNG
Executed: 2006-04-24
Assignee
INFINEON TECHNOLOGIES NORTH AMERICA CORP.
1730 NORTH FIRST STREET, SAN JOSE, CALIFORNIA, 95112
Covered Property (1)
Methods of forming copper interconnect structures on semiconductor substrates
Application: 11/234,535 →
Publication: US 2007/0072413
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 23, 2005
From: CHOI, SEUNG-MAN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 017031/0874 →
Assignment of Assignor's Interest Apr 27, 2006
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 017535/0508 →