Patent Assignment
Reel/Frame 017046/0775
Assignment of Assignor's Interest
Recorded: 2005-09-29
Pages: 3
Assignors
MURAI, HIDEYA
Executed: 2005-07-05
SHIMOTO, TADANORI
Executed: 2005-07-05
FUNAYA, TAKUO
Executed: 2005-07-05
KIKUCHI, KATSUMI
Executed: 2005-07-05
YAMAMICHI, SHINTARO
Executed: 2005-07-05
BABA, KAZUHIRO
Executed: 2005-07-05
HONDA, HIROKAZU
Executed: 2005-07-05
KATA, KEIICHIRO
Executed: 2005-07-05
MATSUI, KOUJI
Executed: 2005-07-05
MIYAZAKI, SHINICHI
Executed: 2005-07-05
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Wiring Substrate for Mounting Semiconductors, Method of Manufacturing the Same, and Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0868 →
Assignment of Assignor's Interest
Jul 12, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0873 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →