Patent Assignment
Reel/Frame 017060/0026
Assignment of Assignor's Interest
Recorded: 2005-09-29
Pages: 3
Assignee
CHIPWORKS INC.
3685 RICHMOND ROAD, SUITE 500, OTTAWA, ONTARIO, K2H 5B7, CANADA
Covered Property
(1)
Method of Preparing an Integrated Circuit Die for Imaging
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Notice of Grant of Security Interest in Patents
Aug 16, 2017
From: TECHINSIGHTS INC.
To: STELLUS CAPITAL INVESTMENT CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 043571/0385 →
Assignment of Assignor's Interest
Jun 20, 2018
From: CHIPWORKS INC.
To: TECHINSIGHTS INC.
Reel/Frame 046143/0682 →
Security Interest
Nov 10, 2021
From: TECHINSIGHTS INC.; VLSI RESEARCH INC.
To: CAPITAL ONE, NATIONAL ASSOCIATION
Reel/Frame 058096/0721 →
Release of Security Interest
Nov 12, 2021
From: STELLUS CAPITAL INVESTMENT CORPORATION, AS ADMINISTRATIVE AGENT
To: TECHINSIGHTS INC.
Reel/Frame 058096/0558 →