IP Library › Assignment 046143/0682
Patent Assignment
Reel/Frame 046143/0682

Assignment of Assignor's Interest

Recorded: 2018-06-20 Pages: 15
Assignor
CHIPWORKS INC.
Executed: 2018-06-14
Assignee
TECHINSIGHTS INC.
1891 ROBERTSON ROAD, SUITE 500, OTTAWA, ONTARIO, K2H 5B7, CANADA
Covered Property (1)
Method of Preparing an Integrated Circuit Die for Imaging
Patent: 7,498,181 →
Application: 11/237,966 →
Publication: US 2007/0072314
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 29, 2005
From: KLIBANOV, LEV; GRIFFIN, SHERRI LYNN
To: CHIPWORKS INC.
Reel/Frame 017060/0026 →
Notice of Grant of Security Interest in Patents Aug 16, 2017
From: TECHINSIGHTS INC.
To: STELLUS CAPITAL INVESTMENT CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 043571/0385 →
Security Interest Nov 10, 2021
From: TECHINSIGHTS INC.; VLSI RESEARCH INC.
To: CAPITAL ONE, NATIONAL ASSOCIATION
Reel/Frame 058096/0721 →
Release of Security Interest Nov 12, 2021
From: STELLUS CAPITAL INVESTMENT CORPORATION, AS ADMINISTRATIVE AGENT
To: TECHINSIGHTS INC.
Reel/Frame 058096/0558 →