Patent Assignment
Reel/Frame 017060/0371
Assignment of Assignor's Interest
Recorded: 2005-10-04
Pages: 2
Assignors
SHIRAMIZU, NOBUHIRO
Executed: 2005-08-17
NAKAMURA, TAKAHIRO
Executed: 2005-08-17
MASUDA, TORU
Executed: 2005-08-19
KASA, NOBUHIRO
Executed: 2005-08-24
MORI, HIROSHI
Executed: 2005-08-26
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Chip with Redistribution Metal Layer
Patent:
40,887 →
Application:
11/183,300 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Assignment of Assignor's Interest
Jul 10, 2013
From: LIN, MOU-SHIUNG; TING, TAH-KANG JOSEPH
To: MEGIC CORPORATION
Reel/Frame 030766/0857 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →