Patent Assignment
Reel/Frame 030766/0857
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 3
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Semiconductor Chip with Redistribution Metal Layer
Patent:
40,887 →
Application:
11/183,300 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 4, 2005
From: SHIRAMIZU, NOBUHIRO; NAKAMURA, TAKAHIRO; MASUDA, TORU; KASA, NOBUHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017060/0371 →
Assignment of Assignor's Interest
May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →