Patent Assignment
Reel/Frame 017135/0589
Assignment of Assignor's Interest
Recorded: 2005-12-20
Pages: 5
Assignors
ENDO, KIMITAKA
Executed: 2005-12-19
MASUDA, NORIHITO
Executed: 2005-12-12
SHIMADA, TOMOKAZU
Executed: 2005-12-12
Assignee
SOCKETSTRATE, INC.
3099 ORCHARD DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Structure and Method of Making Interconnect Element, and Multilayer Wiring Board Including the Interconnect Element
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 3, 2006
From: SOCKETSTRATE, INC.
To: TESSERA INTERCONNECT MATERIALS, INC.
Reel/Frame 017575/0120 →
Merger
Jan 30, 2012
From: TESSERA INTERCONNECT MATERIALS, INC.
To: INVENSAS CORPORATION
Reel/Frame 027622/0384 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →