IP Library Assignment 017174/0714
Patent Assignment
Reel/Frame 017174/0714

Assignment of Assignor's Interest

Recorded: 2005-11-04 Pages: 11
Assignors
LI, JIANXING
Executed: 2005-10-31
FANG, MING
Executed: 2005-07-01
ZHONG, TING
Executed: 2005-07-01
HUA, FAY
Executed: 2005-10-31
LEE, KEVIN J.
Executed: 2005-11-01
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Capping Copper Bumps
Patent: 7,391,112 →
Application: 11/142,971 →
Publication: US 2006/0276022
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →