Patent Assignment
Reel/Frame 017236/0629
Assignment of Assignor's Interest
Recorded: 2005-11-15
Pages: 2
Assignors
KIM, HYOUNG HO
Executed: 2005-11-07
SHIN, HYO SOON
Executed: 2005-11-07
CHOO, HO SUNG
Executed: 2005-11-07
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MEATAN-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Chip Capacitor and Method for Manufacturing the Same