Multilayer chip capacitor and method for manufacturing the same
A multilayer chip capacitor, and a method for manufacturing the same are provided. The capacitor includes a capacitor body having a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes formed on the dielectric layers, each of the internal electrodes including a main electrode portion and a lead portion, chip-protecting side members formed on both sides of the capacitor body to contact both sides of the first and second internal electrodes, and a pair of external electrodes formed on the outer surface of the capacitor body. The width of the main electrode portion is the same as that of the dielectric layers, and the width of the lead portion is smaller than that of the dielectric layers.
1. A multilayer chip capacitor, comprising:
a capacitor body having a plurality of dielectric layers stacked therein;
a plurality of first and second internal electrodes formed on the dielectric layers, each of the internal electrodes including a main electrode portion and a lead portion;
two chip-protecting side members formed on both sides of the capacitor body, respectively, to contact both sides of the first and second internal electrodes, the chip-protecting side members extending along the entire length of the both sides of the capacitor body, respectively; and
a pair of terminal electrodes formed on the outer surface of the capacitor body and connected to the internal electrodes through the lead portions,
wherein the width of the main electrode portion is the same as that of the dielectric layers, and the width of the lead portion is smaller than that of the main electrode portion.
2. The capacitor as set forth in claim 1 , wherein one of the terminal electrodes is connected only to the first internal electrodes, and the other terminal electrode is connected only to the second internal electrodes, the first internal electrodes having a polarity opposite to that of the second internal electrodes.
3. The capacitor as set forth in claim 1 , wherein the dielectric layers have longitudinal margin portions formed at one end of the internal electrodes, respectively.
4. The capacitor as set forth in claim 1 , wherein the chip-protecting side members are formed of ceramic material and epoxy resin.