IP Library › Assignment 017264/0715
Patent Assignment
Reel/Frame 017264/0715

Assignment of Assignor's Interest

Recorded: 2005-11-25 Pages: 2
Assignors
HURWITZ, DROR
Executed: 2005-11-10
FARKASH, MORDECHAY
Executed: 2005-11-10
IGNER, EVA
Executed: 2005-11-10
ZEIDLER, AMIT
Executed: 2005-11-10
STATNIKOV, BORIS
Executed: 2005-11-10
MICHAELI, BENNY
Executed: 2005-11-10
Assignee
AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD.
P.O. BOX 631, MIGDAL HAEMEK 10556, ISRAEL
Covered Property (1)
Novel Integrated Circuit Support Structures and Their Fabrication
Patent: 7,635,641 →
Application: 11/250,421 →
Publication: US 2007/0082501
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 4, 2011
From: AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD.
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 026698/0579 →
Change of Name Feb 15, 2022
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 059115/0768 →