IP Library › Assignment 059115/0768
Patent Assignment
Reel/Frame 059115/0768

Change of Name

Recorded: 2022-02-15 Pages: 5
Assignor
Assignee
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Properties (3)
Novel Integrated Circuit Support Structures and Their Fabrication
Patent: 7,635,641 →
Application: 11/250,421 →
Publication: US 2007/0082501
Advanced Multilayer Coreless Support Structures and Method for Their Fabrication
Patent: 7,682,972 →
Application: 11/421,600 →
Publication: US 2007/0281471
Coreless Cavity Substrates for Chip Packaging and Their Fabrication
Patent: 7,669,320 →
Application: 11/737,269 →
Publication: US 2007/0289127
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 25, 2005
From: HURWITZ, DROR; FARKASH, MORDECHAY; IGNER, EVA; ZEIDLER, AMIT
To: AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD.
Reel/Frame 017264/0715 →
Assignment of Assignor's Interest Jun 27, 2006
From: HURWITZ, DROR; FARKASH, MORDECHAY; IGNER, EVA; STATNIKOV, BORIS
To: AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD.
Reel/Frame 018029/0882 →
Assignment of Assignor's Interest Oct 30, 2007
From: HURWITZ, DROR; FARKASH, MORDECHAY; IGNER, EVA; STATNIKOW, BORIS
To: AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD
Reel/Frame 020066/0168 →
Assignment of Assignor's Interest Aug 4, 2011
From: AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD.
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 026698/0579 →