Patent Assignment
Reel/Frame 018029/0882
Assignment of Assignor's Interest
Recorded: 2006-06-27
Pages: 2
Assignors
HURWITZ, DROR
Executed: 2006-06-26
FARKASH, MORDECHAY
Executed: 2006-06-26
IGNER, EVA
Executed: 2006-06-26
STATNIKOV, BORIS
Executed: 2006-06-26
MICHAELI, BENNY
Executed: 2006-06-26
Assignee
AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD.
P.O. BOX 631, MIGDAL HAEMEK, ISRAEL
Covered Property
(1)
Advanced Multilayer Coreless Support Structures and Method for Their Fabrication
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 4, 2011
From: AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD.
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 026698/0579 →
Change of Name
Feb 15, 2022
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 059115/0768 →