IP Library › Assignment 020066/0168
Patent Assignment
Reel/Frame 020066/0168

Assignment of Assignor's Interest

Recorded: 2007-10-30 Pages: 4
Assignors
HURWITZ, DROR
Executed: 2007-08-21
FARKASH, MORDECHAY
Executed: 2007-08-21
IGNER, EVA
Executed: 2007-08-21
STATNIKOW, BORIS
Executed: 2007-08-21
MICHAELI, BENNY
Executed: 2007-08-21
Assignee
AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD
BOX 631, MIGDAL HAEMEK, 23105, ISRAEL
Covered Property (1)
Coreless Cavity Substrates for Chip Packaging and Their Fabrication
Patent: 7,669,320 →
Application: 11/737,269 →
Publication: US 2007/0289127
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 4, 2011
From: AMITEC-ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD.
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 026698/0579 →
Change of Name Feb 15, 2022
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 059115/0768 →