IP Library Assignment 017273/0396
Patent Assignment
Reel/Frame 017273/0396

Assignment of Assignor's Interest

Recorded: 2005-11-21 Pages: 3
Assignors
FEUSTEL, FRANK
Executed: 2005-05-19
LEHR, MATTHIAS
Executed: 2005-05-19
KUECHENMESITER, FRANK
Executed: 2005-05-19
Assignee
ADVANCED MICRO DEVICES, INC.
5204 E. BEN WHITE BLVD., AUSTIN, TEXAS, 78741
Covered Property (1)
Technique for Enhancing Thermal and Mechanical Characteristics of an Underfill Material of a Substrate/Die Assembly
Patent: 7,306,976 →
Application: 11/284,292 →
Publication: US 2006/0246627
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Affirmation of Patent Assignment Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023119/0083 →