Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly
View Patent ↗During the formation of an underfill material provided between a carrier substrate and a semiconductor chip, a common motion of particles contained in the underfill material is initiated towards the semiconductor chip, thereby adjusting the thermal and mechanical behavior of the underfill material. For instance, by applying an external force, such as gravity, a depletion zone with respect to the filler particles may be created in the vicinity of the carrier substrate, while a high particle concentration may be obtained in the vicinity of the semiconductor chip. Hence, thermal and mechanical stress redistribution by means of the underfill material may be enhanced.
1. A method, comprising:
attaching a carrier substrate to a semiconductor chip having formed therein an integrated circuit;
providing a viscous underfill material between the carrier substrate and the semiconductor chip, said underfill material containing particles; and
adjusting a distribution of said particles in the underfill material by applying an external force to obtain, at least temporarily, a collective motion of said particles towards said semiconductor chip.
2. The method of claim 1 , wherein said external force is substantially represented by gravity.
3. The method of claim 2 , further comprising curing said underfill material, wherein, during curing said underfill material, said carrier substrate and said semiconductor chip are, at least temporarily, substantially vertically disposed, with said semiconductor chip being positioned below said carrier substrate.
4. The method of claim 1 , wherein attaching said carrier substrate to said semiconductor chip comprises bonding said carrier substrate to said semiconductor chip by connecting one of bumps and contact pads formed on said semiconductor chip with one of bumps and contact pads formed on said carrier substrate.
5. The method of claim 4 , wherein said underfill material is provided prior to connecting one of said bumps and contact pads formed on said semiconductor chip with one of said bumps and contact pads formed on said carrier substrate.
6. The method of claim 4 , wherein said underfill material is filled in after bonding said carrier substrate to said semiconductor chip.
7. The method of claim 4 , wherein bonding said carrier substrate to said semiconductor chip is performed with a specified spatial orientation of said carrier substrate with respect to said semiconductor chip, said method further comprising changing said specified spatial orientation for adjusting said particle distribution by gravity.
8. The method of claim 1 , wherein said external force comprises a centrifugal force.
9. The method of claim 8 , further comprising controlling an angular speed to adjust a magnitude of said centrifugal force in accordance with a target distribution of said particle distribution.
10. A method, comprising:
attaching a carrier substrate to a semiconductor chip having formed therein an integrated circuit;
providing a viscous underfill material between said carrier substrate and said semiconductor chip, said underfill material containing particles; and
controlling a distribution of said particles in said underfill material by applying an external force to obtain, at least temporarily, a collective motion of said particles towards said semiconductor chip to thereby control a thermal conductivity profile of said underfill material.
11. The method of claim 10 , wherein said external force is substantially represented by gravity.
12. The method of claim 11 , further comprising curing said underfill material, wherein, during curing said underfill material, said carrier substrate and said semiconductor chip are, at least temporarily, substantially vertically disposed, with said semiconductor chip being positioned below said carrier substrate.
13. The method of claim 10 , wherein attaching said carrier substrate to said semiconductor chip comprises bonding said carrier substrate to said semiconductor chip by connecting bumps formed on said semiconductor chip.
14. The method of claim 13 , wherein said underfill material is provided prior to connecting said bumps.
15. The method of claim 13 , wherein said underfill material is filled in after bonding said carrier substrate to said semiconductor chip.
16. The method of claim 13 , wherein bonding said carrier substrate to said semiconductor chip is performed with a specified spatial orientation of said carrier substrate with respect to said semiconductor chip, said method further comprising changing said specified spatial orientation for adjusting said particle distribution by gravity.
17. The method of claim 10 , wherein said external force comprises a centrifugal force.
18. The method of claim 17 , further comprising controlling an angular speed to adjust a magnitude of said centrifugal force in accordance with a target distribution of said particle distribution.