Patent Assignment
Reel/Frame 017309/0295
Assignment of Assignor's Interest
Recorded: 2005-11-30
Pages: 3
Assignee
FREESCALE SEMICONDUCTOR, INC.
LAW DEPARTMENT, 7700 WEST PARMER LANE, AUSTIN, TEXAS, 78729
Covered Property
(1)
Method of making semiconductor package having exposed heat spreader
Application:
11/290,298 →
Publication:
US 2007/0122943
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
Assignment of Assignor's Interest
May 9, 2024
From: EDST, LLC DBA QUEXT
To: MASONITE CORPORATION
Reel/Frame 067364/0390 →