Method of making semiconductor package having exposed heat spreader
A method of making a semiconductor package ( 50 ) includes attaching a bottom surface ( 54 ) of an integrated circuit (IC) die ( 52 ) to a base carrier ( 56 ) and electrically connecting the die ( 52 ) to the base carrier ( 56 ). A first surface ( 66 ) of a heat spreader ( 60 ) is attached to a top surface ( 58 ) of the die ( 52 ). The heat spreader includes a laminate ( 68 ) attached to a second surface ( 70 ) opposite the first surface ( 66 ). The die ( 52 ), the heat spreader ( 60 ), the laminate ( 68 ) and at least a portion of the base carrier ( 56 ) are encapsulated. The laminate ( 68 ) is detached from the heat spreader ( 60 ), which exposes the second surface ( 70 ) of the heat spreader ( 60 ).
1 . A method of making a semiconductor package, comprising:
attaching a bottom surface of an integrated circuit (IC) die to a base carrier;
electrically connecting the die to the base carrier;
attaching a first surface of a heat spreader to a top surface of the die, wherein the heat spreader has a laminate attached to a second surface thereof;
encapsulating the die, the heat spreader, the laminate and at least a portion of the base carrier; and
detaching the laminate from the heat spreader, thereby exposing the second surface of the heat spreader.
2 . The method of making a semiconductor package of claim 1 , wherein side surfaces of the heat spreader are exposed.
3 . The method of making a semiconductor package of claim 1 , wherein a tape is used to detach the laminate from the heat spreader.
4 . The method of making a semiconductor package of claim 1 , wherein a patterned adhesive layer is used to attach the laminate to the heat spreader.
5 . The method of making a semiconductor package of claim 4 , wherein the patterned adhesive layer comprises an adhesive tape having at least one perforation.
6 . The method of making a semiconductor package of claim 1 , wherein a conductive adhesive is used to attach the heat spreader to the die.
7 . The method of making a semiconductor package of claim 1 , further comprising attaching a plurality of solder balls to the base carrier.
8 . The method of making a semiconductor package of claim 1 , wherein the die is electrically connected to the base carrier via a plurality of wire bonded wires.
9 . The method of making a semiconductor package of claim 1 , wherein the die is electrically connected to the base carrier via flip chip bumps.
10 . A method of making a plurality of semiconductor packages, comprising:
attaching respective bottom surfaces of a plurality of integrated circuit (IC) dice to a base carrier;
electrically connecting the dice to the base carrier;
attaching respective bottom surfaces of a plurality of heat spreaders to respective top surfaces of the dice, wherein the heat spreaders have laminates attached to respective top surfaces thereof;
encapsulating the dice, the heat spreaders, the laminate and at least a portion of the base carrier; and
detaching the laminates from the heat spreaders, such that at least the top surfaces of the heat spreaders are exposed.
11 . The method of making a plurality of semiconductor packages of claim 10 , wherein a tape is used to detach the laminate from the heat spreaders.
12 . The method of making a plurality of semiconductor packages of claim 10 , wherein a patterned adhesive layer is used to attach the laminate to the heat spreaders.
13 . The method of making a plurality of semiconductor packages of claim 12 , wherein the patterned adhesive layer comprises an adhesive tape having at least one perforation.
14 . The method of making a plurality of semiconductor packages of claim 10 , wherein a conductive adhesive is used to attach the respective heat spreaders to respective ones of the dice.
15 . The method of making a plurality of semiconductor packages of claim 10 , further comprising attaching a plurality of solder balls to the base carrier.
16 . The method of making a plurality of semiconductor packages of claim 10 , wherein the dice are electrically connected to the base carrier via a plurality of wire bonded wires.
17 . The method of making a plurality of semiconductor packages of claim 10 , wherein the dice are electrically connected to the base carrier via flip chip bumps.
18 . The method of making a plurality of semiconductor packasges of claim 10 , further comprising performing a singulating operation to separate adjacent ones of the dice, wherein side surfaces of the heat spreaders are exposed by the singulating operation.
19 . A method of making a plurality of semiconductor packages, comprising:
attaching respective bottom surfaces of a plurality of integrated circuit (IC) dice to a base carrier;
electrically connecting the dice to the base carrier;
attaching respective first surfaces of a plurality of heat spreaders to respective top surfaces of the dice, wherein the heat spreaders have a laminate attached to respective second surfaces thereof;
encapsulating the dice, the heat spreaders, the laminate and at least a portion of the base carrier;
performing a singulating operation to separate adjacent ones of the dice, wherein side surfaces of the heat spreaders are exposed by the singulating operation; and
detaching the laminate from the heat spreaders, thereby exposing the second surfaces of the heat spreaders.
20 . The method of making a plurality of semiconductor packages of claim 19 , wherein a tape is used to detach the laminate from the heat spreaders.