Patent Assignment
Reel/Frame 017355/0450
Assignment of Assignor's Interest
Recorded: 2005-12-12
Pages: 3
Assignors
TANG, JOHN J.
Executed: 2005-12-08
XU, HENRY
Executed: 2005-12-08
LI, JIANMIN
Executed: 2005-12-08
ZENG, XIANG YIN
Executed: 2005-12-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Copper Plating Connection for Multi-Die Stack in Substrate Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.