Patent Assignment
Reel/Frame 017364/0448
Assignment of Assignor's Interest
Recorded: 2005-12-12
Pages: 2
Assignor
HONG, JI HO
Executed: 2005-12-12
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for removing edge bead in plating process for fabricating semiconductor device
Application:
11/302,061 →
Publication:
US 2006/0137714
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 22, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017654/0078 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017654 Frame 0078. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 22, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017829/0911 →