IP Library Assignment 017367/0751
Patent Assignment
Reel/Frame 017367/0751

Assignment of Assignor's Interest

Recorded: 2005-12-21 Pages: 3
Assignor
KIM, YUNG PIL
Executed: 2005-12-13
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10 DAECHI-DONG KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device and Method for Manufacturing the Same
Patent: 7,575,980 →
Application: 11/312,595 →
Publication: US 2006/0138673
Related Assignments (8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 15, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018176/0351 →
Merger Apr 22, 2015
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 035469/0801 →
Assignment of Assignor's Interest Apr 24, 2015
From: DONGBU HITEK CO., LTD.
To: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
Reel/Frame 035491/0744 →
Assignment of Assignor's Interest May 12, 2015
From: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 035620/0771 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →