IP Library Assignment 017387/0500
Patent Assignment
Reel/Frame 017387/0500

Assignment of Assignor's Interest

Recorded: 2005-12-16 Pages: 3
Assignor
FUKAZAWA, MOTOHIKO
Executed: 2005-12-13
Assignee
SEIKO EPSON CORPORATION
4-1 NISHI-SHINJUKU 2-CHOME SHINJUKU-KU, TOKYO, 163-0811, JAPAN
Covered Property (1)
Semiconductor Device Manufacturing Method, Semiconductor Device, Laminated Semiconductor Device, Circuit Substrate, and Electronic Apparatus
Patent: 7,387,949 →
Application: 11/305,451 →
Publication: US 2006/0131713
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2012
From: SEIKO EPSON CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028153/0654 →