Patent Assignment
Reel/Frame 017404/0100
Assignment of Assignor's Interest
Recorded: 2005-12-22
Pages: 3
Assignor
KIM, HEE-DAE
Executed: 2005-12-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming a Metal Interconnection Line in a Semiconductor Device Using an Fsg Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.