Patent Assignment
Reel/Frame 017420/0747
Assignment of Assignor's Interest
Recorded: 2006-04-05
Pages: 2
Assignor
SUZUKI, SHINSUKE
Executed: 2006-03-01
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device and Method of Manufacturing Bonding Sheet
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.