IP Library › Assignment 017447/0676
Patent Assignment
Reel/Frame 017447/0676

Assignment of Assignor's Interest

Recorded: 2006-04-10 Pages: 5
Assignors
KERDILES, SEBASTIEN
Executed: 2006-02-15
DURET, CARINE
Executed: 2006-02-15
VAUFREDAZ, ALEXANDRE
Executed: 2006-02-15
METRAL, FREDERIC
Executed: 2006-02-15
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
PARC TECHNOLOGIQUE DES FONTAINES, CHEMIN DES FRANQUES, BERNIN, 38190, FRANCE
Covered Property (1)
Process and Equipment for Bonding by Molecular Adhesion
Patent: 7,601,271 →
Application: 11/357,771 →
Publication: US 2007/0119812
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 1, 2012
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 027793/0535 →