IP Library › Assignment 017461/0596
Patent Assignment
Reel/Frame 017461/0596

Assignment of Assignor's Interest

Recorded: 2006-01-13 Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2002-01-18
LEE, JIN-YUAN
Executed: 2002-01-18
HUANG, CHING-CHENG
Executed: 2002-01-18
Assignee
MEGIC CORPORATION
21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Circuitry Component with Metal Layer Over Die and Extending to Place Not Over Die
Patent: 7,511,376 →
Application: 10/638,018 →
Publication: US 2004/0046254
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017600/0649 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →