Circuitry component with metal layer over die and extending to place not over die
View Patent ↗An integrated chip package structure and method of manufacturing the same is by adhering dies on a metal substrate and forming a thin-film circuit layer on top of the dies and the metal substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.
1. A chip package comprising:
a metal substrate;
only one die;
an adhesive material adhering a bottom surface of said only one die to said metal substrate;
a first polymer layer over said metal substrate, wherein said only one die is in said first polymer layer;
a second polymer layer on a top surface of said only one die, on said first polymer layer and across an edge of said only one die;
a circuit layer on said second polymer layer, over said top surface of said only one die, over said first polymer layer and across said edge of said only one die, wherein said circuit layer comprises an electroplated metal, wherein said circuit layer comprises a portion as a part of a capacitor, and wherein said circuit layer is connected to said only one die through an opening in said second polymer layer; and
a third polymer layer on said circuit layer, on said second polymer layer, over said top surface of said only one die, over said first polymer layer and across said edge of said only one die.
2. The chip package of claim 1 further comprising a gold bump over said first polymer layer.
3. The chip package of claim 1 , wherein said electroplated metal comprises copper.
4. The chip package of claim 1 further comprising a solder bump over said first polymer layer.
5. The chip package of claim 1 , wherein said adhesive material comprises an adhesive tape adhering said bottom surface to said metal substrate.
6. The chip package of claim 1 , wherein said adhesive material comprises a conductive paste adhering said bottom surface to said metal substrate.
7. The chip package of claim 1 , wherein said metal substrate comprises a copper substrate.
8. The chip package of claim 1 , wherein said first polymer layer comprises an epoxy.
9. A chip package comprising:
a metal substrate;
only one die;
an adhesive material adhering a bottom surface of said only one die to said metal substrate;
a first polymer layer over said metal substrate, wherein said only one die is in said first polymer layer;
a second polymer layer on a top surface of said only one die, on said first polymer layer and across an edge of said only one die;
a circuit layer on said second polymer layer, over said top surface of said only one die, over said first polymer layer and across said edge of said only one die, wherein said circuit layer comprises an electroplated metal, wherein said circuit layer comprises a portion as a part of an inductor, and wherein said circuit layer is connected to said only one die through an opening in said second polymer layer; and
a third polymer layer on said circuit layer, on said second polymer layer, over said top surface of said only one die, over said first polymer layer and across said edge of said only one die.
10. The chip package of claim 9 further comprising a gold bump over said first polymer layer.
11. The chip package of claim 9 , wherein said electroplated metal comprises copper.
12. The chip package of claim 9 further comprising a solder bump over said first polymer layer.
13. The chip package of claim 9 , wherein said first polymer layer comprises an epoxy.
14. The chip package of claim 9 , wherein said second polymer layer comprises polyimide.
15. The chip package of claim 9 , wherein said second polymer layer comprises benzocyclobutene (BCB).
16. The chip package of claim 9 , wherein said adhesive material comprises a conductive paste adhering said bottom surface to said metal substrate.
17. The chip package of claim 9 , wherein said third polymer layer comprises polyimide.
18. The chip package of claim 9 , wherein said third polymer layer comprises benzocyclobutene (BCB).
19. The chip package of claim 9 , wherein said metal substrate comprises a copper substrate.
20. The chip package of claim 9 , wherein said metal substrate comprises an aluminum alloy.
21. A chip package comprising:
a metal substrate;
only one die;
an adhesive material adhering a bottom surface of said only one die to said metal substrate;
a first polymer layer over said metal substrate, wherein said only one die is in said first polymer layer;
a second polymer layer on a top surface of said only one die, on said first polymer layer and across an edge of said only one die;
a circuit layer on said second polymer layer, over said top surface of said only one die, over said first polymer layer and across said edge of said only one die, wherein said circuit layer comprises an electroplated metal, wherein said circuit layer comprises a portion as a part of a resistor, and wherein said circuit layer is connected to said only one die through an opening in said second polymer layer; and
a third polymer layer on said circuit layer, on said second polymer layer, over said top surface of said only one die, over said first polymer layer and across said edge of said only one die.
22. The chip package of claim 21 , wherein said metal substrate comprises a copper substrate.
23. The chip package of claim 21 further comprising a gold bump over said first polymer layer.
24. The chip package of claim 21 further comprising a solder bump over said first polymer layer.
25. The chip package of claim 21 , wherein said second polymer layer comprises polyimide.
26. The chip package of claim 21 , wherein said second polymer layer comprises benzocyclobutene (BCB).
27. The chip package of claim 21 , wherein said adhesive material comprises an adhesive tape adhering said bottom surface to said metal substrate.
28. The chip package of claim 21 , wherein said third polymer layer comprises benzocyclobutene (BCB).
29. The chip package of claim 21 , wherein said adhesive material comprises a conductive paste adhering said bottom surface to said metal substrate.
30. The chip package of claim 21 , wherein said electroplated metal comprises copper.
31. The chip package of claim 21 , wherein said metal substrate comprises an aluminum alloy.
32. The chip package of claim 21 , wherein said third polymer layer comprises polyimide.
33. The chip package of claim 21 , wherein said first polymer layer comprises an epoxy.