IP Library Assignment 017465/0917
Patent Assignment
Reel/Frame 017465/0917

Assignment of Assignor's Interest

Recorded: 2006-01-17 Pages: 2
Assignor
ANG, TING CHEONG
Executed: 2006-01-03
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG RD., PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property (1)
Method and System for Metal Barrier and Seed Integration
Patent: 8,309,456 →
Application: 11/249,141 →
Publication: US 2006/0110902
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2013
From: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
Reel/Frame 029625/0763 →