Patent Assignment
Reel/Frame 029625/0763
Assignment of Assignor's Interest
Recorded: 2013-01-14
Pages: 6
Assignor
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Executed: 2012-11-23
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG RD., PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
18 WEN CHANG ROAD, ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100176, CHINA
Covered Properties
(65)
Method for Processing a Photomask for Semiconductor Devices
Method and System for Metal Barrier and Seed Integration
Split Dual Gate Field Effect Transistor
System and Method for I/O Esd Protection with Floating and/or Biased Polysilicon Regions
Method for Cleaning Backside Etch During Manufacture of Integrated Circuits
Cmos Image Sensor
System and Method for Direct Etching
Reliability Test Structure for Multilevel Interconnect
System and Method for Manufacturing Contact
Method and System for Image Sensor and Lens on a Silicon Back Plane Wafer
Method and Structure for Copper Gap Fill Plating of Interconnect Structures for Semiconductor Integrated Circuits
Silicon Germanium and Polysilicon Gate Structure for Strained Silicon Transistors
Method of Eliminating Micro-Trenches During Spacer Etch
Method for Forming P-Type Lightly Doped Drain Region Using Germanium Pre-Amorphous Treatment
Atomic Layer Deposition Epitaxial Silicon Growth for Tft Flash Memory Cell
Tft Sas Memory Cell Structures
A Method of Forming Tft Floating Gate Memory Cell Structures
Method of Interconnect for Image Sensor
Method and System for Calibrating Exposure System for Manufacturing of Integrated Circuits
Method and Structure for Fabricating Smooth Mirrors for Liquid Crystal on Silicon Devices
Semiconductor Device with Amorphous Silicon Monos Memory Cell Structure and Method for Manufacturing Thereof
Device Under Bonding Pad Using Single Metallization
Method and Device for a Cmos Image Sensor
Application:
12/582,694 →
Publication:
US 2010/0165165
System and Method for Test Structure on a Wafer
System and Method for I/O Esd Protection with Polysilicon Regions Fabricated by Processes for Making Core Transistors
Method and System for Determining Semiconductor Characteristics
Method and Structure for Performing a Chemical Mechanical Polishing Process
System and Method for Detecting One or More Winding Paths for Patterns on a Reticle for the Manufacture of Semiconductor Integrated Circuits
System and Method for Metal-Oxide-Semiconductor Field Effect Transistor
Amplitude Shift Keyed (Ask) Demodulation Pattern and Use in Radio Frequency Identification (Rfid)
Method for Manufacturing Nano-Crystalline Silicon Material for Semiconductor Integrated Circuits
Method for Manufacturing Twin Bit Structure Cell with AL2O3/Nano-Crystalline Si Layer
Method and System for Continuous Line-Type Landing Polysilicon Contact (Lpc) Structures
System and Method for Quality Assurance for Reticles Used in Manufacturing of Integrated Circuits
Method of Flash Memory Design with Differential Cell for Better Endurance
Method of Programming Flash Memory of the Differential Cell Structures for Better Endurance
Electrically Programmable Device with Embedded Eeprom and Method for Making Thereof
Multilayer Oxide on Nitride on Oxide Structure and Method for the Manufacture of Semiconductor Devices
Method and Structure for Self Aligned Contact for Integrated Circuits
Method and System for Cmos Image Sensing Device
Wireless Memory Card and Method Thereof
Method of Rapid Thermal Treatment Using High Energy Electromagnetic Radiation of a Semiconductor Substrate for Formation of Epitaxial Materials
Method for Manufacturing Nano-Crystalline Silicon Material from Chloride Chemistries for the Semiconductor Integrated Circuits
Via Contact Structures and Methods for Integrated Circuits
Non-Volatile Memory Having Nano Crystalline Silicon Hillocks Floating Gate
Method and Structure for Silicon Nanocrystal Capacitor Devices for Integrated Circuits
Application:
12/887,481 →
Publication:
US 2011/0095396
Structure and Method for Semiconductor Testing
Application:
12/887,491 →
Publication:
US 2011/0074459
Scalable Flash Eeprom Memory Cell with Floating Gate Spacer Wrapped by Control Gate and Method of Manufacture
Surrounding Stacked Gate Multi-Gate Fet Structure Nonvolatile Memory Device
Cmos Image Sensor with Non-Contact Structure
Method for Fabricating an Enlarged Oxide-Nitride-Oxide Structure for Nand Flash Memory Semiconductor Devices
Method for Copper Hillock Reduction
Method and Structure for Electro-Plating Aluminum Species for Top Metal Formation of Liquid Crystal on Silicon Displays
Application:
12/938,166 →
Publication:
US 2011/0109856
Semiconductor Device with a 7F2 Cell Structure
Application:
12/938,178 →
Publication:
US 2011/0108889
Method for Determining Color Using Cmos Image Sensor
Method for Forming a Cmos Image Sensing Pixel
System and Method for Eeprom Architecture
Method for Manufacturing Twin Bit Structure Cell with Aluminum Oxide Layer
Method for Manufacturing Twin Bit Structure Cell with Silicon Nitride Layer
Method for Manufacturing Twin Bit Structure Cell with Floating Polysilicon Layer
Application:
12/969,563 →
Publication:
US 2011/0140192
Method for Manufacturing Twin Bit Structure Cell with Hafnium Oxide Layer
Application:
12/978,346 →
Publication:
US 2011/0156123
Method for Manufacturing Twin Bit Structure Cell with Hafnium Oxide and Nano-Crystalline Silicon Layer
Method and Device for Cmos Image Sensing with Multiple Gate Oxide Thicknesses
Anti-Fuse Based Programmable Serial Number Generator
System and Method for Input Pin Esd Protection with Floating and/or Biased Polysilicon Regions
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 27, 2004
From: CHAO, CHU CHU
To: SEMICONDUCTOR MANUFACTURING
Reel/Frame 015743/0643 →
Assignment of Assignor's Interest
Jan 17, 2006
From: ANG, TING CHEONG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 017465/0917 →
Assignment of Assignor's Interest
Nov 17, 2006
From: XIAO, DEYUAN; SENG, TAN LEONG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 018532/0591 →
Assignment of Assignor's Interest
Mar 2, 2007
From: SU, TING CHIEH; LIAO, CHIN CHANG; HUANG, JUN CHENG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 018993/0946 →
Assignment of Assignor's Interest
Apr 4, 2007
From: HUO, JIE GUANG; YANG, JIANPING
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 019115/0348 →
Assignment of Assignor's Interest
Jun 25, 2007
From: WU, JINGANG; LUO, FEI; GAO, GUANQIE; YANG, CHENG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 019472/0084 →
Assignment of Assignor's Interest
Aug 17, 2007
From: SHI, WEN; RUAN, WEI WEI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 019734/0974 →
Assignment of Assignor's Interest
Aug 27, 2007
From: JENG, MINI CHIE
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 019780/0736 →
Assignment of Assignor's Interest
Jan 24, 2008
From: XIN, CHUN YAN
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 020412/0065 →
Assignment of Assignor's Interest
Feb 20, 2008
From: HAN, TAO; FAN, JIANGUO
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 020537/0195 →
Assignment of Assignor's Interest
Feb 25, 2008
From: HUANG, HERB; FUMITAKE, MIENO
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 020556/0981 →
Assignment of Assignor's Interest
Mar 7, 2008
From: XIANG, YANG HUI
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 020618/0757 →
Assignment of Assignor's Interest
Oct 24, 2008
From: ANG, TING CHEONG
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 021737/0005 →
Assignment of Assignor's Interest
Oct 24, 2008
From: LEE, CHIA HAO
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 021737/0075 →
Assignment of Assignor's Interest
Jan 8, 2009
From: MIENO, FUMITAKE
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 022079/0024 →
Assignment of Assignor's Interest
Jan 12, 2009
From: MIENO, FUMITAKE
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 022089/0128 →
Assignment of Assignor's Interest
Feb 23, 2009
From: MIENO, FUMITAKE
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 022294/0941 →
Assignment of Assignor's Interest
Mar 3, 2009
From: GAO, DAVID; ZHU, BEI; WU, HANMING; CHEN, JOHN
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 022339/0365 →
Assignment of Assignor's Interest
Mar 23, 2010
From: CHANG, YAN WU; LIM, TEK SING
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 024125/0607 →