IP Library › Assignment 019734/0974
Patent Assignment
Reel/Frame 019734/0974

Assignment of Assignor's Interest

Recorded: 2007-08-17 Pages: 2
Assignors
SHI, WEN
Executed: 2007-07-18
RUAN, WEI WEI
Executed: 2007-07-18
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG RD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property (1)
Reliability Test Structure for Multilevel Interconnect
Patent: 8,323,990 →
Application: 11/728,184 →
Publication: US 2008/0128693
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2013
From: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
Reel/Frame 029625/0763 →