Patent Assignment
Reel/Frame 020618/0757
Assignment of Assignor's Interest
Recorded: 2008-03-07
Pages: 3
Assignor
XIANG, YANG HUI
Executed: 2003-12-30
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Method and Structure for Copper Gap Fill Plating of Interconnect Structures for Semiconductor Integrated Circuits
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.