Patent Assignment
Reel/Frame 017494/0501
Assignment of Assignor's Interest
Recorded: 2005-07-27
Pages: 5
Assignors
DUBOIS, GERAUD JEAN-MICHEL
Executed: 2005-07-22
HEDRICK, JAMES LUPTON
Executed: 2005-07-22
KIM, HO-CHEOL
Executed: 2005-07-22
LEE, VICTOR YEE-WAY
Executed: 2005-07-22
MAGBITANG, TEDDIE PEREGRINO
Executed: 2005-07-22
MILLER, ROBERT DENNIS
Executed: 2005-07-22
SANKARAPANDIAN, MUTHUMANICKAM
Executed: 2005-07-25
SUNDBERG, LINDA KARIN
Executed: 2005-07-22
VOLKSEN, WILLI
Executed: 2005-07-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method of Forming Low-K Interlevel Dielectric Layers and Structures
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →