Patent Assignment
Reel/Frame 017521/0416
Assignment of Assignor's Interest
Recorded: 2006-01-30
Pages: 4
Assignors
IKEDA, MITSUTAKA
Executed: 2006-01-12
KIKUMA, KATSUHITO
Executed: 2006-01-12
NOGAMI, SACHIKO
Executed: 2006-01-12
AKASHI, YUJI
Executed: 2006-01-16
Assignee
SPANSION LLC
ONE AMD PLACE, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
Multi-chip package and method of fabricating the same
Application:
11/261,174 →
Publication:
US 2006/0108677
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Assignment of Assignor's Interest
Jun 11, 2015
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 035888/0807 →